Package Level Reliability Training Course

Day One:

I. Introduction

A. History of electronics and reliability
B. Basic Definitions

1. Yield, Quality and Reliability
2. Lifetime, Failure, Degradation and Failure Criterion
3. Failure time distributions
4. Percentiles

C. Reliability Evaluation Strategies
D. Different Failure Mechanisms
E. Acceleration Factors

Lunch

II. Electromigration

A. Basics
B. Types of failures: Voids-Hillocks
C. How to measure?
D. Definitions and determination of TCR and Joule Heating
E. Lifetime models
F. Overview of standards
G. Al <-> Cu
H. Electromigration <-> Stressmigration

Day Two:

III. TDDB

A. Basics
B. Types of failure: QBD-HBD
C. How to measure: different stress/measurement techniques
D. Lifetime models
E. Overview of standards
F. Charge to breakdown <-> Time to breakdown

Lunch

IV. HCI/NBTI

A. Basics
B. Types of failure
C. Different parameters of interest
C. How to measure: different stress/measurement techniques
D. Lifetime models
E. Overview of standards
F. Relaxation

Trainer : Kristof Croes

Courses

Reliability Training Course:
-Data analysis and reporting

Wafer Level Reliability

Package Level Reliability

ESD and Latch-Up