Design of Test Structures

   
 

The Electromigration test structure is used to monitor the self diffusion of aluminum in a preferred direction due to momentum transfer from electrons flowing in a metal line.

Time Dependent Dielectric Breakdown . Three different test structures are used to detect defects in capacitors or gate oxides made of thin layers of SiO 2 , which are subjected to time dependent dielectric breakdown.

Fast Hot Carrier - The rate of hot carrier trapping can be examined using a test transistor with the drain enclosed by the gate. This test is performed by forcing the drain-to-substrate diode to avalanche breakdown.

     
Self Heated By Resister with Via Electromigration Chain. Via Electromigration test structure with "build-in" poly heater that can provide rapid temperature cycling stresses and high constant temperature stress.

 

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