Reliability Solution
Package Level Reliability
Wafer Level Reliability
Advanced Interconnects
Failure Analysis
Curve Tracer System
DC Parametric Solution
Probe Card
Consumables & Parts
Burn-In Board
Capabilities
Temperature Cycle for oven and Constant Current Stress Measurement.
Description
The XACT-850 test system is a high performance.Interconnects test system for evaluating the balls or bumps resistance. The system is capable of low contact resistance measurement due to it high accuracy and low noise High Current Source, 1A or 3A. The change in the resistance is further enhanced by the temperature cycle oven.
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