Reliability Solution

    Package Level Reliability

    Wafer Level Reliability

    Advanced Interconnects

 

 Failure Analysis

    Curve Tracer System

 

 DC Parametric Solution

    Probe Card

 

 Consumables & Parts

    Burn-In Board

 


XACT-850



Capabilities

 

Temperature Cycle for oven and Constant Current Stress Measurement.

 

Description

 

 

The XACT-850 test system is a high performance.

Interconnects test system for evaluating the balls or bumps resistance.

The system is capable of low contact resistance measurement due to it high accuracy and low noise High Current Source, 1A or 3A.

The change in the resistance is further enhanced by the temperature cycle oven.

 

 

 

 

 

 

 

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