Capabilities

Copper Electromigration Test (EM) and Thin Dielectrics Time Dependent Dielectric Breakdown Test (TDDB)

Description

The SPC8000 is a high temperature (350 °C), large lot, fully integrated package level reliability evaluation system for electromigration (EM) and time dependent dieletric breakdown (TDDB) testing. This highly reliable, most stable and user friendly system is all you need for testing, data collection, data analysis and report generation to ensure the integrity of your process.

The SPC8010 is a high temperature (400 °C), compact and small volume test system. It allow you to test, gather data, analyze data and generate reports to ensure the integrity of your process. The SPC8010 system is the most reliable and most stable test system available for package level electromigration (EM) and time dependent dielectric breakdown (TDDB) testing. All measurement elements are included as integral components.

Capabilities

Electromigration Test (EM)

Description

The XACT-810 test system is a high performance EM system for evaluating the quality and reliability of all types of interconnects in semiconductor products under temperature and current stress. This system is an in-situ test system, where the resistance change is monitored continously with a high measurement resolution.

Capabilities

Hot Carrier Degradation/Negative Bias Temperature Instability (HCI/NBTI) Test System

Description

The XACT-830 test system is a high performance HCI/NBTI system for evaluating the quality and reliability of all types of transistors in semiconductor products under either temperature and/or voltages stress. This system is an in-situ test system, where the change in the transistor characteristic parameters is monitored continously with a high measurement resolution.