
Package Level Reliability
Wafer Level Reliability
Advanced Interconnects
Curve Tracer System
Probe Card
Burn-In Board |
|
|
Capabilities |
|
Multi purpose wafer
level tester. |
Description
|
|
Fully automated wafer level deep submicron reliability
evaluation station,with capabilities to perform parallel
testing.
|
Features
|
|
Sequential-parallel test architecture, up to 8 SMUs or Voltage Sources supported over one system, enabling parallel testing or up to 8 DUTs or more at the same time.
Full integration with industry's latest model semi-auto and automatic probe stations.
Allows separate test program definition per site, sub-site and wafer.

|
|
|
©2010 Chiron Technology Pte Ltd